Lead Free Assembly
The Lead Free Assembly ProcessThe RoHS legislation requires that none of the hazardous materials listed in the RoHS Directive are used in the printed circuit board, components or solder. This means that the finishes on bare printed circuit boards must be changed to comply with lead free and RoHS standards. As a result, higher temperatures, around 30-50 degrees higher, are usually required to assemble lead free printed circuit boards. All components and boards must be able to withstand this additional heat. Also, it is important to note that the IC moisture sensitivity level that indicates how long the board can be exposed to the air is approximately 2 classes higher for lead free printed circuit boards, so there can be increased moisture sensitivity. The shelf life of the materials used in lead free boards may also be shorter.
A lead free assembled board may look differently. This is because the lead free solder has a different metallic composition. Please keep in mind that our technicians are experts at quality control and will guarantee that all lead free assembly is performed accurately to your exact specifications.
Our Lead-Free Process
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